Integrated membrane-free thermal flow sensor for silicon-on-glass microfluidics
The device has an accuracy at the level of world leaders - no worse than 5% in the range of 0-30 µl / min
Contact lithography and bonding unit
The installation is designed to perform contact lithography on substrates of various materials (silicon, glass), combining photo masks with substrates and subsequent exposure to ultraviolet light. It is also designed to combine a plate with another one for bonding for the purpose of subsequent splicing in the bonding unit.
Key features and capabilities: