Thermal Processes Unit

Bonding (splicing) installation of SB6 / 8 Gen2 plates, SUSS Microtec (Germany)

  

The unit is designed for splicing plates by anodic, thermocompression, polymer, adhesive bonding, eutectic and frits.

Key features and capabilities:

  • splicing of plates (silicon and glass) with dimensions of 200 mm, 150 mm, 100 mm, as well as pieces of plates with a maximum linear size of up to 76 mm;
  • compatibility with the installation of alignment and exposure for automatic processing of pre-aligned and fixed relative to each other plates;
  • crevice feed of the plates, ensuring the purity of the process of splicing;
  • glued system thickness - 6 mm;
  • the number of plates in one load - 2;
  • vacuum in the bonding chamber - 5 * 10-5 mbar;
  • types of gases for pumping - inert gases and air;
  • maximum temperature inside the chamber - 500 оС;
  • temperature uniformity - ± 3%;
  • temperature repeatability - ± 3%;
  • temperature stability - ± 2%;
  • maximum voltage during bonding - 2 kV;
  • maximum bonding current strength - 60 mA;
  • maximum bonding force - 20 kN;
  • the presence of an autoloader for feeding pre-aligned plates into the splicing chamber.

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